may 2011 doc id 17264 rev 1 1/7 7 STPS3045C-Y automotive power schottky rectifier features very small conduction losses negligible switching losses extremely fast switching low thermal resistance avalanche rated aec-q101 qualified description this device is a dual center tap schottky rectifier suited for switch mode power supply and high frequency dc to dc converters. packaged in d 2 pak, this device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. table 1. device summary i f(av) 2 x 15 a v rrm 45 v t j (max) 175 c v f (max) 0.57 v k a1 a2 d 2 pak stps3045cgy a1 a2 k www.st.com
characteristics STPS3045C-Y 2/7 doc id 17264 rev 1 1 characteristics when the diodes 1 and 2 are used simultaneously : t j (diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode 2) x r th(c) to evaluate the conduction losses use the following equation: p = 0.42 x i f(av) + 0.01 i f 2 (rms) table 2. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 45 v i f(rms) forward rms voltage 30 a i f(av) average forward current = 0.5 t c = 155 c per diode per device 10 30 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 220 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 6000 w t stg storage temperature range -65 to +175 c t j maximum operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink -40 to +175 c dv/dt critical rate of rise reverse voltage 10000 v/s table 3. thermal resistance parameters symbol parameter value unit r th (j-c) junction to case per diode to t a l 1.60 0.85 c/w r th (c) coupling 0.10 c/w table 4. static electrical characteristics (per diode) symbol parameter tests condit ions min. typ. max. unit i r (1) 1. pulse test: t p = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm --200a t j = 125 c - 11 40 ma v f (1) forward voltage drop t j = 125 c i f = 15 a - 0.5 0.57 v t j = 25 c i f = 30 a - - 0.84 t j = 125 c - 0.65 0.72 dptot dtj --------------- 1 rth j a ? () ------------------------- - <
STPS3045C-Y characteristics doc id 17264 rev 1 3/7 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5, per diode) p (w) f(av) 0 1 2 3 4 5 6 7 8 9 10 11 12 02468101214161820 = 0.05 = 0.1 = 0.2 = 0.5 = 1 i (a) f(av) t =tp/t tp i (a) f(av) 0 2 4 6 8 10 12 14 16 18 0 25 50 75 100 125 150 175 t (c) amb t =tp/t tp r =15c/w th(j-a) figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t) p (25c) arm j arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values, per diode) figure 6. relative variation of thermal impedance junction to ambient versus pulse duration i (a) m 0 20 40 60 80 100 120 140 160 180 200 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 t(s) t =75c c t =100c c t =125c c z/r th(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 t (s) p t =tp/t tp = 0.5 = 0.2 = 0.1 single pulse
characteristics STPS3045C-Y 4/7 doc id 17264 rev 1 figure 7. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 8. junction capacitance versus reverse voltage applied (typical values, per diode) 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 0 5 10 15 20 25 30 35 40 45 i (a) r v (v) r t =150c j t =125c j t =100c j t =75c j t =50c j t =25c j c(nf) 100 1000 10000 1 10 100 v (v) r f=1mhz v =30mv t =25c osc rms j figure 9. forward voltage drop versus forward current (maximum values, per diode) figure 10. thermal resistance junction to ambient versus copper surface under tab i (a) fm 1 10 100 1000 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 v (v) fm t =125c (maximum values) j t =125c (typical values) j t =25c (maximum values) j 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 s(cm2) r (c/w) th(j-a) epoxy printed circuit board, copper thickness = 35 m
STPS3045C-Y package information doc id 17264 rev 1 5/7 2 package information epoxy meets ul94,v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. footprint dimensions (in millimeters) table 5. package dimensions d 2 pa k ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2mm a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
ordering information STPS3045C-Y 6/7 doc id 17264 rev 1 3 ordering information 4 revision history table 6. ordering information order code marking package we ight base qty delivery mode stps3045cgy-tr stps3045cgy d 2 pak 1.48 g 1000 tape and reel table 7. document revision history date revision changes 24-may-2011 1 initial release.
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